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| Ask the Experts | ||
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July 30, 2007 - Updated July 29, 2007 - Originally Posted Scribe lines for depaneling boards
Is there any standard or recommended specification used by board manufacturers for the depth of the scribe lines used to depanel boards? Appreciate your insight.
Brian Wall
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| Expert Panel Responses | ||
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A 30% score depth on each side should work. Pay attention to alignment of the two "V" cuts. Prashant Joshi Director of Engineering, Interconnect Systems Inc.
Prashant has 15 years experience in design and process development. With a MS in Mechanical/ Materials Engineering his areas of interest are connectors, electronics assembly, SMT, reballing, wire bond.
The document you are looking for is IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Page 14 Fig 5-2 Provides all the information you will need to determine the Scoring parameters for depaneling the boards.
Vice President, Technical Director, EPTAC Corporation
At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.
The specifications tend to be based on the web thickness (board remaining) rather then the depth of the scribe lines. I good place to go is Vscore Central.
CEO & Managing Partner, DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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