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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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May 1, 2006 - Updated
July 5, 2007 - Originally Posted
What is the best solder lead free alloy for step solder process on assemblies with SAC305?
What is the best solder lead free alloy for step solder process on assemblies with SAC305?
T.C.
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| Expert Panel Responses |
The work done by the IPC Solder Product Value Council no discernible difference between the various SAC alloys that were studied therefore if you already have SAC305 in your process and on the assembly then it is desirable that you stay with that alloy for all soldering applications for that assembly. This will eliminate the opportunity for the generation of any none eutectic alloys which have the potential for reliability issues. Also using a single alloy will make it easier should any rework or repair ever be needed in the future.
Neil Poole
Senior Applications Chemist, Henkel Electronics
Dr. Poole is a Senior Applications Chemist in Henkel Technologies, electronics assembly materials application engineering group. He is responsible for all of Henkel's assembly products including soldering products, underfills, PCB protection materials, and thermally conductive adhesives.
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