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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
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August 21, 2006 - Updated
July 5, 2007 - Originally Posted
Small hole via plating reliability
Where would I find studies on small hole (.006"-.010" mechanical drill) via plating reliability?
R.O.
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| Expert Panel Responses |
Plating reliability tends to be a function of hole size only with the respect to aspect ratio (board thickness/hole diameter). See IPC TR-579 for reliability predictions. However, you seem to be suggesting concerns with hole quality? Please feel free to contact me directly to help resolve your question.
Dr. Craig D. Hillman
CEO & Managing Partner, DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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