circuitnet
Sponsor
Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Critical Considerations for Tin Whisker Mitigation
Sponsor
Summit Interconnect
Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
Ask the Experts
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
August 21, 2006 - Updated
July 5, 2007 - Originally Posted

Small hole via plating reliability

Where would I find studies on small hole (.006"-.010" mechanical drill) via plating reliability?
R.O.
Expert Panel Responses
Plating reliability tends to be a function of hole size only with the respect to aspect ratio (board thickness/hole diameter). See IPC TR-579 for reliability predictions. However, you seem to be suggesting concerns with hole quality? Please feel free to contact me directly to help resolve your question.

Dr. Craig D. Hillman
Dr. Craig D. Hillman
CEO & Managing Partner, DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
Test & Inspection