Questions about wave soldering 0402 chips

Our Engineers decided they needed to put 0402 bypass caps on the opposite side of the board from a 256-pin, .8 mm pitch, fully populated plastic BGA. They are not providing escape vias for all balls, so there are areas where they can place the parts. My questions are concerning the wave solder process for these 0402 chips. 1. Do you recommend wave soldering 0402 chips at all? 2. Since the parts are only 0.6 mm thick, do I need to be careful of rotational orientation (component long axis perpendicular to wave solder conveyor direction)? 3. What clearance do I need between component pads and the nearest exposed vias? 4. What diameter and height of stenciled glue dot do you recommend?