|
Sponsor
|
|
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
|
|
|
Sponsor
|
|
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
|
|
| Ask the Experts |
|
QUESTIONS
SUBMIT
MEMBERS
JOIN
|
October 9, 2006 - Updated
July 4, 2007 - Originally Posted
Repair damaged pads on Teflon Substrates
Is there a repair method out there for repairing lifted/damaged pads on Teflon substrates?
Michelle Elston
|
| Expert Panel Responses |
Teflon is a bit more difficult to bond a replacement pads to, but certainly can be done. We have a procedure online you may wish to take a look at. See our online procedure 4.7.2 Surface Mount Pad Repair, Film Adhesive Method.
Jeff Ferry
President, Circuit Technology Center, Inc.
Mr. Ferry is President of Circuit Technology Center, a world-leading contractor for the repair and rework of assembled circuit boards founded in 1983. Jeff also serves as Publisher of Circuitnet and Semiconductor Packaging News.
|
|
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
Sponsor
|
|
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
|
|
|
