Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

Sponsor

Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Ask the Experts

October 16, 2006 - Updated
July 4, 2007 - Originally Posted

Removing Voids in BGA Process

We have been told that the process described below, to remove voids in a BGA, is not reliable. We would like to know what the consequences are in doing this and what would make the process not reliable.

The process:
We place a small amount of liquid water soluble flux under the BGA. Using a hot air rework station we heat the board and BGA until the solder reaches a liquidus state then lift the BGA about .150" to .250" above the site and hold for 10 to 12 seconds. We then place it back down on the site and finish out the profile. The maximum temperature measured at a solder ball is 210 F.

We X-ray and the voids have been eliminated.

D.V.

Expert Panel Responses

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura