High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies. Air-Vac Engineering
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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here. Plasmatreat GmbH
December 27, 2006 - Updated
July 4, 2007 - Originally Posted
Pad sizes for BGA devices
What is the recommended copper pad size for attaching 20, 30 and 35 mils solder ball? Is there any standard I could use?
Bang Do
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Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more Glenbrook Technologies
