Here are a few reads, in order of difficulty.
SMT Principles and Practice - By Ray Prasad
Electronics Packaging and Interconnection Handbook - By Harper
Electronics Packaging Handbook - By Blackwell
Fundamentals of Microsystems Packaging - By Tumulla
inspīre solutions LLC
Bjorn Dahle is the President of inspīre solutions LLC. He has 20 years experience in the electronic manufacturing industry with various manufacturing equipment companies covering pick & place, screen printers and thermal process management.
Join the Surface Mount Technology Association and then you can use their website.
Regional Sales Manager
OK International Inc.
Mr. Zamborsky serves as one of OK's technology advisers to the Product Development group. Ed has authored articles and papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead Free Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework.
There are many books and publications which can supply the information you are looking for relative to electronic fabrication,
I would also highly recommend doing a search on attached Amazon site.
Solders and Soldering, and you will get more references to as much material as you can absorb.
- Soldering Electronic Assemblies by Leo Lambert
- Solder and Soldering by Howard Manko
- A Scientific Guide to Surface Mount Technology by Colin Lea
- Soldering In Electronics by R.J. Klein Wassink
- Cleaning and Contamination of Electronic Components and Assemblies by B.N. Ellis
- Electronic Packaging & Interconnection Handbook, by Charles Harper
- Electronics Manufacturing, with Lead-Free, Halogen-Free & Conductive-Adhesive Materials, by John Lau, C.P. Wong, Ning Cheng Lee, S.W. Ricky Lee
- Printed Circuits Handbook, by Clyde Coombs, Jr.
- The Handbook of Machine Soldering, SMT and TH by Ralph Woodgate.
- Modern Solder Technology for Competitive Electronics Manufacturing by Jennie S. Hwang
Vice President, Technical Director
At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.
The Printed Circuits Handbook Fifth Edition, Coombs is a great resource that might be of use. I have used it throughout my career as reference textbook.
Stacy Kalisz Johnson
Americas Marketing Development Manager
Ms. Johnson's entry into the electronic packaging arena was as a Package Development Engineer. Stacy recently joined the Americas Field Marketing Organization as a Marketing Development Manager for the Americas where she continues to work on AOI, AXI and also In-Circuit Test.
NOTE: Ms. Johnson is no longer working at Agilent Technologies.
Here are two links that might be helpful.
SMTA Bookstore IPC
If there are any questions or if additional information is needed, please feel free to ask.
Heller Industries Inc.
Mr. Peo has been with Heller Industries for over 20 years and has been President for the past 8 years. Marc has authored several industry articles on Soldering, Flux collection, nitrogen use and Lead Free conversion.
You may wish to consider taking the SMTA's class for certification in SMT Assembly. It would quickly provide you a good beginning understanding of at least the SMT assembly processes.
Richard D. Stadem
Richard D. Stadem is an advanced engineer/scientist for General Dynamics and is also a consulting engineer for other companies. He has 38 years of engineering experience having worked for Honeywell, ADC, Pemstar (now Benchmark), Analog Technologies, and General Dynamics.