High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies. Air-Vac Engineering
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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here. Plasmatreat GmbH
March 26, 2007 - Updated
July 4, 2007 - Originally Posted
Exposed copper and oxidation
Is there any concern in the industry about exposed copper sites such as busbar bolted to copper pad, wire lug bolted to copper pad, or EMI spring finger contacting copper pad oxidizing over time and effecting electrical continuity?
L.T.
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Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more Glenbrook Technologies
