| Ask the Experts |
|
QUESTIONS
SUBMIT
MEMBERS
JOIN
|
April 23, 2007 - Updated
July 4, 2007 - Originally Posted
Solder cracking specs
Since 2005 we have been performing strain gage studies to identify potential issues with crack capacitor on some steps of manufacturing production. The specification that we have been using is that the value can not exceed 1000ue. Can we use this type of studies for solder crack (reflow) SnPb? If so, are there any specs or parameters that we can use, and some correlation between ue (micro strain) and force? Please let me know if there are any specs or websites.
H.F.
|
| Expert Panel Responses |
We have studied the effect of bending loads on components and joint integrity with particular focus on the effects of manual depanelling. We did present our findings to some major Automotive companies and were informed that the 1000ue value is high as a baseline. The general consensus was that 500ue is a more appropriatte level for maintaining yeilds. I have not seen any document that directly relates force to strain. Our tests clearly showed a relationship of force/distance/strain as you would expect, the longer the lever the lower the load required to exert X strain.
Allen W. Duck
CEO, ATEK llc
Allen Duck is a 20-year Electronics Industry veteran with Global experience in multiple fields of technology and management. He started A-Tek in 2006 to provide a sales and service channel for international equipment companies wishing to offer value based solutions to USA companies.
|
|
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
