|
Sponsor
|
|
iX7059 SMT Edition: Next-Gen 3D X-ray
Experience high-precision inline 3D X-ray inspection by Viscom with AI-powered defect detection, exceptional image quality, and reliable performance for complex SMT assemblies.
Viscom SE
|
|
|
Sponsor
|
|
Automated Storage for High-Mix EMS Production
High mix electronics manufacturing requires reliable material management. This white paper explains how BMK enhanced traceability, inventory accuracy and picking efficiency using integrated automated storage, digital workflows, reel-level visibility.
Essegi Automation
|
|
| Ask the Experts |
|
QUESTIONS
SUBMIT
MEMBERS
JOIN
|
May 29, 2007 - Updated
July 4, 2007 - Originally Posted
ICT testing after assembly
Is there any efficient testing method for ICT testing after assembly? The surface finishing is OSP. Will this induce poor contact for the probes on the test point? What kind of test probes can we select to improve first pass yield?
MingWang Lee
|
| Expert Panel Responses |
For In-Circuit Test (ICT), an OSP finish on conventional test pads is a source of connectivity problems where test probes sometimes have trouble getting good contact. To avoid this, one consideration would be utilizing Bead Probe Technology as an alternative. More details on how bead probes can be of benefit can be found on our website.
Stacy Kalisz Johnson
Americas Marketing Development Manager, Agilent Technologies
Ms. Johnson's entry into the electronic packaging arena was as a Package Development Engineer. Stacy recently joined the Americas Field Marketing Organization as a Marketing Development Manager for the Americas where she continues to work on AOI, AXI and also In-Circuit Test. NOTE: Ms. Johnson is no longer working at Agilent Technologies.
|
|
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
Sponsor
|
|
AIT BUF7669-NP: Diamond-Based Film
• Diamond-based dielectric film for AI chiplets, enabling >8 W/m-K thermal conductivity substrates; • Stress-absorbing polymer with 18 ppm/°C CTE; • Made in USA; ABF alternative
AI Technology
|
|
|
