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kyzen

Maintenance: The Basics of Cleaning Series Part 4
This is the final paper in a series and discusses some of the common mistakes in maintenance cleaning applications found in electronic assembly operations.
KYZEN
Ormet-TLPS
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Advanced-Interconnections

Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.

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Santosh Kumar


R&D Manager
MK Electron Co. Ltd

Santosh Kumar is R&D Manager at the MK Electron Co. Ltd., Korea and engaged in the electronic interconnect materials development and technical marketing. His key focus is novel lead-free solder materials, electronics packaging, wire bonding materials and process.

Santosh Kumar has submitted responses to the following questions.
Solution for Grape Effect
Graping is due to un-reflowed solder particles atop the solder mass. This results from higher lead-free reflow temperatures,the decrease in ...
ESD Grounding - 1 Meg Ohm Resistor
To prevent the electrostatic charge build-up for ESD protection, everything which can acquire a charge is grounded including people working ...
Challenges with 01005 Components
01005 component size is small and it presents many challenges in its assembly.However, one of the most challenging aspect is ...
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SEIKA-America

Malcom Paste Mixers
Unlike hand mixing, the Malcom SPS Solder Paste Mixer is a non-contaminating mixer which utilizes pseudo planetary motion to stir the solder paste. The SPS-1 provides uniform consistency.
Seika
Master-Bond