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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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Ask the Experts Member |
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Santosh Kumar
R&D Manager
MK Electron Co. Ltd
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Santosh Kumar is R&D Manager at the MK Electron Co. Ltd., Korea and engaged in the electronic interconnect materials development and technical marketing. His key focus is novel lead-free solder materials, electronics packaging, wire bonding materials and process.
Santosh Kumar has submitted responses to the following questions.
Solution for Grape Effect
Graping is due to un-reflowed solder particles atop the solder mass. This results from higher lead-free reflow temperatures,the decrease in ...
ESD Grounding - 1 Meg Ohm Resistor
To prevent the electrostatic charge build-up for ESD protection, everything which can acquire a charge is grounded including people working ...
Challenges with 01005 Components
01005 component size is small and it presents many challenges in its assembly.However, one of the most challenging aspect is ...
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