circuitnet
Sponsor
SCHUNK
Gripping Systems from micro assembly to heavy lifting
The first industrial-suited grippers from SCHUNK were a milestone. Since then we have brought countless newly and further developments to market.
SCHUNK
Affordable Profiling
Sponsor
Glenbrook Technologies
Refurbished and Demo X-ray Inspection Systems
2026 Demo JewelBox-70T X-ray System and 2026 Demo JewelBox-100T X-ray System Refurbished & Demo Systems on sale with warranty. Learn more.
Glenbrook Technologies
Ask the Experts Member
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
Santosh Kumar

Santosh Kumar

R&D Manager
MK Electron Co. Ltd
Santosh Kumar is R&D Manager at the MK Electron Co. Ltd., Korea and engaged in the electronic interconnect materials development and technical marketing. His key focus is novel lead-free solder materials, electronics packaging, wire bonding materials and process.

Santosh Kumar has submitted responses to the following questions.
Solution for Grape Effect
Graping is due to un-reflowed solder particles atop the solder mass. This results from higher lead-free reflow temperatures,the decrease in ...
ESD Grounding - 1 Meg Ohm Resistor
To prevent the electrostatic charge build-up for ESD protection, everything which can acquire a charge is grounded including people working ...
Challenges with 01005 Components
01005 component size is small and it presents many challenges in its assembly.However, one of the most challenging aspect is ...
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Master Bond
Toughened, Non-Drip Epoxy
Master Bond Supreme 121AOND is a toughened, heat curing adhesive for bonding and sealing applications that offers chemical resistance and a high glass transition temperature.
Master Bond
The path to reliable electronics