Sponsor

Proven Flip-Chip Flux for AI Packages
WS-641 is a proven high-performance flip-chip flux for 2.5D packaging, trusted by leading OSATs to deliver consistent results & reliability in advanced CoW applications.
Indium Corporation

The Economics of Electronic Component Salvage and Reuse

Sponsor

Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD

Ask the Experts Member

Santosh Kumar

R&D Manager
MK Electron Co. Ltd

Santosh Kumar is R&D Manager at the MK Electron Co. Ltd., Korea and engaged in the electronic interconnect materials development and technical marketing. His key focus is novel lead-free solder materials, electronics packaging, wire bonding materials and process.

Santosh Kumar has submitted responses to the following questions.

Solution for Grape Effect
Graping is due to un-reflowed solder particles atop the solder mass. This results from higher lead-free reflow temperatures,the decrease in ...

ESD Grounding - 1 Meg Ohm Resistor
To prevent the electrostatic charge build-up for ESD protection, everything which can acquire a charge is grounded including people working ...

Challenges with 01005 Components
01005 component size is small and it presents many challenges in its assembly.However, one of the most challenging aspect is ...

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Thixotropic, Dual Cure Adhesive
Master Bond UV23FLDC-80TK is a dual curing adhesive that withstands rigorous thermal cycling and is suitable for applications where low stress is critical. View full specs.
Master Bond