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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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Ask the Experts Member |
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Richard Henrick
Quality Assurance/Regulatory Compliance Manager
Sanmina Corporation
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Richard has 18 years experience in the medical electronics industry at both a contract manufacturer and OEM. His experience includes PWA and finished device manufacturing as a Manufacturing Engineer and during the past 7 years as plant Quality Assurance/Regulatory Compliance Manager. He holds 5 American Society for Quality Certifications and is a Certified IPC 610 Trainer.
Richard Henrick has submitted responses to the following questions.
Twisting Multi-strand Wires
No, twisting is generally not necessary. However, IPC-A-610 states, "Wire strands disturbed during insulation removal process should be restored to ...
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