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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC
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Ask the Experts Member |
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Richard Henrick
Quality Assurance/Regulatory Compliance Manager
Sanmina Corporation
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Richard has 18 years experience in the medical electronics industry at both a contract manufacturer and OEM. His experience includes PWA and finished device manufacturing as a Manufacturing Engineer and during the past 7 years as plant Quality Assurance/Regulatory Compliance Manager. He holds 5 American Society for Quality Certifications and is a Certified IPC 610 Trainer.
Richard Henrick has submitted responses to the following questions.
Twisting Multi-strand Wires
No, twisting is generally not necessary. However, IPC-A-610 states, "Wire strands disturbed during insulation removal process should be restored to ...
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Thermally Conductive, Low Outgassing Epoxy
Master Bond EP21AOLV-2LO is an electrically insulating adhesive that meets NASA low outgassing requirements for sealing, coating and encapsulation applications. Ask an expert.
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