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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
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Ask the Experts Member |
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Steve Bowen
Manufacturing Engineer
Benchmark Electronics, Minnesota Division
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Steve Bowen is a Manufacturing Engineer with knowledge of solder paste printing, stencil design, 3D paste inspection and the P&P process. Steve has 15+ years experience and is an SMTA Certified Engineer.
Steve Bowen has submitted responses to the following questions.
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