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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
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Ask the Experts Member |
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Steve Bowen
Manufacturing Engineer
Benchmark Electronics, Minnesota Division
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Steve Bowen is a Manufacturing Engineer with knowledge of solder paste printing, stencil design, 3D paste inspection and the P&P process. Steve has 15+ years experience and is an SMTA Certified Engineer.
Steve Bowen has submitted responses to the following questions.
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Need Improved Solder Joint Visibility?
Solder Peel-A-Wayš Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
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