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Fix Pad Alignment Defects Without Scrapping Valuable Circuit Boards
Discover proven PCB rework techniques for correcting footprint mismatches, replacing pads, and restoring assemblies to meet IPC requirements without board replacement.
Circuit Technology Center

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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering

Ask the Experts Member

Steve Bowen

Manufacturing Engineer
Benchmark Electronics, Minnesota Division

Steve Bowen is a Manufacturing Engineer with knowledge of solder paste printing, stencil design, 3D paste inspection and the P&P process. Steve has 15+ years experience and is an SMTA Certified Engineer.

Steve Bowen has submitted responses to the following questions.

Most Important Factors for Screen Printing
Solder paste volume is less critical than printalignment. My experience shows that apaste deposit can be 50% of the ideal ...

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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura