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440-R + Ultrasonics = Safe & Efficient Cleaning
Clean any type of solder paste in the same machine using 440-R-SMT Detergent. It is the one detergent that will do it all: stencils, pallets, misprints & SMD adhesives.
Smart Sonic

Essential Practices for Gold Mitigation of Electronic Components

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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura

Ask the Experts Member

Steve Bowen

Manufacturing Engineer

Benchmark Electronics, Minnesota Division

Steve Bowen is a Manufacturing Engineer with knowledge of solder paste printing, stencil design, 3D paste inspection and the P&P process. Steve has 15+ years experience and is an SMTA Certified Engineer.

Steve Bowen has submitted responses to the following questions.

Most Important Factors for Screen Printing
Solder paste volume is less critical than printalignment. My experience shows that apaste deposit can be 50% of the ideal ...

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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH