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Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
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Rent any of our machine models, with up to 3 months of rental costs applied toward purchasing X-ray equipment. Our flexible plan lets you test the system before committing to purchase.
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Steve Bowen


Manufacturing Engineer
Benchmark Electronics, Minnesota Division

Steve Bowen is a Manufacturing Engineer with knowledge of solder paste printing, stencil design, 3D paste inspection and the P&P process. Steve has 15+ years experience and is an SMTA Certified Engineer.


Steve Bowen has submitted responses to the following questions.
Most Important Factors for Screen Printing
Solder paste volume is less critical than printalignment. My experience shows that apaste deposit can be 50% of the ideal ...
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Master-Bond

Low Outgassing, Thermally Conductive Epoxy
Master Bond EP21AOLV-2LO is a low outgassing, thermally conductive, electrically isolating adhesive that can be used for sealing, coating and encapsulating.
Master Bond
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