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Highly Thermally & Electrically Conductive TLPS via Filing Paste
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Ormet TLPS

Critical Considerations for Tin Whisker Mitigation

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Your Domestic PCB Solution
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Summit Interconnect

Ask the Experts Member

Steve Bowen

Manufacturing Engineer

Benchmark Electronics, Minnesota Division

Steve Bowen is a Manufacturing Engineer with knowledge of solder paste printing, stencil design, 3D paste inspection and the P&P process. Steve has 15+ years experience and is an SMTA Certified Engineer.

Steve Bowen has submitted responses to the following questions.

Most Important Factors for Screen Printing
Solder paste volume is less critical than printalignment. My experience shows that apaste deposit can be 50% of the ideal ...

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Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH