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Micro Dispensing Technology White Paper
The trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size.
DL Technology

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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
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Ask the Experts Member

Steve Bowen

Manufacturing Engineer

Benchmark Electronics, Minnesota Division

Steve Bowen is a Manufacturing Engineer with knowledge of solder paste printing, stencil design, 3D paste inspection and the P&P process. Steve has 15+ years experience and is an SMTA Certified Engineer.

Steve Bowen has submitted responses to the following questions.

Most Important Factors for Screen Printing
Solder paste volume is less critical than printalignment. My experience shows that apaste deposit can be 50% of the ideal ...

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Salvaging Electronic Components: Ensuring Economic Reuse
Component salvaging provides a reliable and consistent method of harvesting electronic components, reducing electronic waste, minimizing fabrication of new components, and ensuring economic reuse for automated assembly.
BEST Inc.