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Mark Waterman
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Engineer / Trainer
Electronic Controls Design, Inc. (ECD)
Mark Waterman is a trainer and field engineer with 17 years experience in service and applications specialties. Intimate knowledge of soldering processes and measurement systems. Six sigma and statistical process control generalist.

Mark Waterman has submitted responses to the following questions.
Specific Solder To Control Dendritic Growth
It is not normal that a customer would specify a specific paste, although most customers don't have enough knowledge of ...
Production Floor Temperature and Humidity Loggers
Temperature and humidity can effect ESD, MSD, screen printing, working time, and shelf life. If you don't measure / monitor ...
Rechecking Thermal Profiles
The short answer is Yes. After refining the oven recipe to produce the ideal profile, the only way to verify ...
Test Probe Problems After Pin-In-Paste
No clean paste fluxes are designed to encapsulate the solder joint after reflow and protect it from oxidation, moisture, etc.. ...
What is Causing Solder Joint Cracking
This sounds like intermittent cold solder joints. You should be able to get a more repeatable process from a selective ...
A Generic Reflow Profile
The short term  justification is that it saves time (change over and recipe generation), the same way as not performing ...
Reflow Oven Calibration Schedule
Most manufacturing best practices say 1 year as a general guideline, but ultimately this needs to be determined by your ...
Mixing SAC305 and SACX0307 Solder Alloys
The effects are unknown because you would really never know the exact alloy you are working with at any given ...
Cause of Cracking on SOT23 Components
As only some of the parts are cracking, I would measure the thermal profile of both the good and the ...
Test for Flux Penetration
You can use a paper on top of the board that is reactive to your specific flux. This is the ...
Ideal Relative Humidity for Final Assembly
Like most things it is a compromise. Higher humidity increases corrosion (oxidation) and reduces static. Low humidity reduces corrosion, but ...
Lead Free Reflow Oven Zone Count
The number of zones allow for more control of the profile shape, and usually higher production speeds. The minimum number ...
Batch Reflow vs. In-line Reflow
The real concerns here are the heating types, and work flows. What type of heating does it use IR, convection, ...
Board Spacing During Reflow
Convection reflow requires heated air pass around the board for proper heating. If the boards are run edge to edge, ...
Solder Fillet Peaks
The peak is formed from the solder turning solidus as the tip is being removed. This indicates that the components ...
APEX Trade Show Feedback
In general the mood was cautiously optimistic. Leading indicators and recent trends suggest that the worst is over, but many ...
Solder Thieving Explanation
An observation first made with through hole components was that, as a row of leads or footprints leaves the wave ...
What Is the Life Span for a Profile Board?
This is dependent on many factors including thermal exposure, substrate material, and even thermocouple attachment method. In general for the ...