Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

Sponsor

Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Ask the Experts Member

Clive Ashmore

Global Process Manager

ASM

Mr. Ashmore is responsible for the Global Applied Process Engineering group for DEK. Clive specializes in all aspects of manufacturing engineering, with special emphasis on mass imaging technologies.

Clive Ashmore has submitted responses to the following questions.

Transfer Efficiency Greater Than 100%
Yep this greater than 100% is a strange one. When I've experienced this observation it's been caused by excessive solder ...

Rework or Repair?
My thoughts are:Solder splash on contacts are caused by poor process control/design and therefore should be defined as rework as ...

Stencil Life
The simple answer to usage rates is No... The easiest way to tell if the stencil is end of life ...

Pin-in-Paste Hole Fill
The best solution for the Pin-in-Paste process is the ProFlowR enclosed head system. The main reason for this is that ...

Screen Print Shelf Life
The answer to this is normally solder paste-dependent. Different formulas likely have varying abandon times. But, generally speaking, a water ...

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura