Ask the Experts
August 14, 2017
Solder Paste Past Shelf Life
We have some solder paste that has been in a sealed box at 4degree Celsius for more than 8 months. The shelf life is 6 months. Canit be used?
What adverse effect might we expect, if any, using solder paste slightly over the shelf life?
Expert Panel Responses
Best to follow solder paste manufacturer's recommendations,however, it would be worthwhile to print some and test it before recycling theexpired paste. Test for printability, solderability, voids, filletformation and fillet wetting angles. If everything is acceptable, thenwhy not use? It is best to repeat using another jar. If any of theattributes fail or if at all suspicious, return it to the supplier forrecycling and replacement.
A thirty year veteran of electronics assembly with major OEMs including Digital Equipment Corp., Compaq and Hewlett-Packard. President of Colab Engineering, LLC; a consulting agency specializing in electronics manufacturing, root-cause analysis and manufacturing improvement. Holder of six U.S. process patents. Authored several sections and chapters on circuit assembly for industry handbooks. Wrote a treatise on laser soldering for Laser Institute of America's LIA Handbook of Laser Materials Processing. Diverse background includes significant stints and contributions in electrochemistry, photovoltaics, silicon crystal growth and laser processing prior to entering the world of PCAs. Member of SMTA. Member of the Technical Journal Committee of the Surface Mount Technology Association.
Ifyou do not have internal capability to re-certify the material, contact themanufacturer. They should be able to re-certify it. The concerns are asfollows:
Internally,you would need to run a print test to confirm that the paste still printsacceptably. You would also need to run reflow tests to ensure that the fluxactivity as acceptable. A controlled solder spread test would be best, but forthat you really need a baseline to compare to. Finally, you would need to lookat hot slump, to ensure that any viscosity behavior changes have not resultedin a dramatic change in slump behavior.
- Viscosity changes that will affect printing and/or slump
- Reactions between the metal powder and flux that will consumesome of the flux activity (and also affect viscosity)
Fritz's career in electronics manufacturing has included diverse engineering roles including PWB fabrication, thick film print & fire, SMT and wave/selective solder process engineering, and electronics materials development and marketing. Fritz's educational background is in mechanical engineering with an emphasis on materials science. Design of Experiments (DoE) techniques have been an area of independent study. Fritz has published over a dozen papers at various industry conferences.
Solder paste consists of three major elements, solder powder ofa give size, flux, and a viscosity agent. All three work together to create therheology of the solder paste. The size of the powder allows the paste to beused for specific size terminations, the flux is selected to reduce the oxideson the materials being soldered and the viscosity agent being able to maintainsuspension of the powder within the mass of solder powder within the solderpaste mixture. Without the proper viscosity material the solder powder wouldseparate and sink to the bottom of the jar.
The other issue with solder paste is the function of the flux.In plated through hole soldering the flux is used to prepare the componentleads and the circuit board prior to soldering. The same applies to flux withinthe core of the wire solders being used in the industry. However the flux inthe solder paste has an extra function, preparing the solder powder inaddition to preparing the component lead and pad area.
Since the flux is in constant contact with the solder powder, itis continually acting on the oxides on the surfaces of the solder powder orspheres, and this action reduces the activity levels of the fluxes. This isalso why it is always recommended to refrigerate the solder paste to reducethis chemical reaction with the solder powder and give a longer shelf life tothe material.
Whether or not the solder paste can be used, would depend uponthe type of flux being used, be it either a low activity, medium activity, orhigh activity flux. The adverse affect would be un-reflowed solder paste,insufficient reflow, solder balls, dewetting, etc.
The recommendations would be to perform a solderability test,slump test and flux activity test on the solder paste itself and see if itstill performs to the original standards of the material.
Vice President, Technical Director
At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.
Shelflife typically defines the warranty limit for a solder paste. Many remainfully functional beyond the published shelf life. It the solder pasteprints or dispenses and reflows appropriately it should be ok. If eitherapplication or reflow looks abnormal you probably should not use it. Typical symptoms of age are poor print or dispense and visual soldering defectssuch as incomplete coalescence and abnormal solder balls.
Application Engineering Supervisor
Mr. Vivari has more than 15 years of electronic engineering design and assembly experience. His expertise in fluid dispensing and solder paste technology assists others in identifying the most cost effective method for assembling products.
If the solder paste appears normal after allowing it to cometo room temperature, with no visible separation... it's probably OK to use.There may reduced stencil life, rheology changes and a minorimpact on wetting, but if it prints and reflows OK... It's OK.
The real issues are: "I'll save a couple hundred bucksby using expired paste and potentially, increase defects and rework due toclogged apertures, so is it worth it?" Even worse... suppose there's anissue after the build ships to the customer and they start asking questions andyou're forced to reveal expired paste was used... that could get reallyuncomfortable and potentially very expensive.
1st Rule of SMT assembly - Solder paste performance is thefoundation of the process - it's the last place one should scrimp.
Technical Marketing Manager
Tim O'Neill is the Technical Marketing Manager for AIM Products. AIM is a global supplier of materials for the PCB assembly industry including solders, fluxes and thermal management materials. Tim has a B.A. from Assumption College and post-graduate studies in education. He has 20 years of experience in the electronics soldering industry, beginning his career in 1994 with EFD and was key in business development of their fine pitch solder paste dispensing technology. Tim joined AIM in 1997 and has since assisted many clients with assembly challenges, specializing in Pb-Free process development and material selection.