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Prototyping to High-Speed Production
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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| Ask the Experts |
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March 11, 2014 - Updated
March 4, 2014 - Originally Posted
PCB Outsourcing
I am a business writer and piecing together a white paper on PCB outsourcing. What are the top 4 or 5 criteria used to determine where to outsource assembly of printed circuit boards?
M.M.
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| Expert Panel Responses |
From my perspective the top 4 or 5 items to consider foroutsourcing printed circuit board assembly are the following not necessarily inthe order presented.- Financial control of cost of component placement, cost ofmaterials product and finish cost of product.
- Ability to deliver quality product in a timely fashion.
- Quality systems within facility to monitor quality cost andprocess yields, including an internal cost savings program.
- Qualified and certified personnel working on the productincluding engineering staff to work assembly drawing issues andinterpretations.
- Close businessrelationship with customer utilizing dedicated service managers working withindividual customer.
Leo Lambert
Vice President, Technical Director
EPTAC Corporation
At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.
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AI Void Detection - X-Ray Inspection
X-ray Inspection for hidden and buried solder joints. BGA, QFN, THT, and more. High Speed and High Resolution configurations available.
Test Research, Inc.
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