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December 2, 2013

Question About SN100 Solder

Is there any published reliability data on SN100 for SMT reflow applications? We currently use SAC305, but one manufacturer is suggesting SN100 low residue no-clean.


Experts Comments

There is some data available. The vast majority of data is still by far on the SAC305 default lead-free alloy since alloy accounts for 99% of users and has been in use for over 10 years now.

There are a few users of SnCu based solder pastes right now although cost reduction pressures are pushing for these alternatives having low or no silver. One characteristic that is noted by experience is a lesser wetting using SnCu based solders, so there are process changes required if you are to maintain solder joint reliability.

I do not believe it is a drop in and some stencil design and reflow profile changes are required for its implementation to be truly successful. Some high reliability customers also engage on extensive tests to confirm joint metallurgy is within their expectations.
Peter Biocca
Senior Market Development Engineer
Mr. Biocca was a chemist with many years experience in soldering technologies. He presented around the world in matters relating to process optimization and assembly. He was the author of many technical papers delivered globally. Mr. Biocca was a respected mentor in the electronics industry. He passed away in November, 2014.
Both DfR Solutions and iNEMI have published data on SN100C performance. For the most part, it falls in between SAC305 and SnPb.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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