| Sponsor |
|
iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
|
|
| Sponsor |
|
Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
|
|
| Ask the Experts |
|
|
December 12, 2011 - Updated
December 12, 2011 - Originally Posted
Benchmark Price for Contract Assembly
We are a contractmanufacturer. A customer wants to pay us $0.0016 per component on a newassembly. Is there a benchmark price per component for assembly services?
O. C.
|
| Expert Panel Responses |
Let's say that there are 1600 components on the assy. Big PCB.
You are running a 35,000 per hour placement machine that has avalue of $220,000 dollars. (Chip Shooter)
This machine could place a little more than 9 components in onesecond.
At 0.0016 per component you would make $0.0144 dollars per secondor 0.864 dollars per minute or $51.84 dollars per hour.
If your burden factor (what it cost you per hour to keep yoursdoors open) is at $125.00 this does not seem to be a wise choice to accept thetask offered.
Your burden factor, materials cost if any and thru-put rate forthe whole process will set the price on the services.
Terry Jeglum
President/CEO
Electronic Technology Corporation
Mr. Jeglum has 35+ years experience and is the founder of Electronic Technology Corporation. He is responsible for 22 years of program management for the Company.
|
|
Submit A Comment
|
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated
|
|
|