| Sponsor |
|
iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
|
|
| Sponsor |
|
Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
|
|
| Ask the Experts |
|
|
November 16, 2011 - Updated
November 14, 2011 - Originally Posted
Mixing Solders
Is there a problem if the following 2 solderchemistries are mixed on a PCBA?
Sn96.5 Ag3.0 Cu0.5 and Sn95.5 Ag4.0 Cu0.5
M. D.
|
| Expert Panel Responses |
Absolutelynot, for all practical and most physical and chemical reasons, they areidentical before,during and after the soldering process so mixing them wouldhave no effect.
Richard Boyle
Global Product Champion
Henkel Electronics
Richard Boyle is a Global Product Champion at Henkel Electronics. He has over 25 years experience in the electronics assembly industry and is responsible for the global technical service of all of Henkel's solder materials.
|
|
Submit A Comment
|
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated
|
|
|
