We search for industry news, so you don't need to.
Ask the Experts  
Questions Index  ■  Submit a Question  ■  Experts Panel  ■  Join the Panel

October 31, 2011

CEM1 Laminate Issues

We use CEM1 laminate. The laminate bubbles and de-laminates during the reflow process. Is CEM1 laminate designed for the higher temperatures of lead free solder?

The boards are stored sealed with a desiccant inside the package. We have tried pre-baking the boards for a couple of hours at 100 degrees C, but don't see much improvement. I know this could be cured by changing to FR4, but the cost is a concern. Is there a solution?



A. N.

Experts Comments

CEM1 is a paper-core material laminated with a thin layer of fiberglass. It is not usually able to withstand higher reflow temperatures associated with lead-free solder processing, in fact, it is even problematic for 63/37 solder processing and is typically only used for single-layer PWBs.

I sure wish I could provide some good news. If I knew more about the CCA, I could possibly provide you with alternative processing ideas.

Richard D. Stadem
Advanced Engineer/Scientist
General Dynamics
Richard D. Stadem is an advanced engineer/scientist for General Dynamics and is also a consulting engineer for other companies. He has 38 years of engineering experience having worked for Honeywell, ADC, Pemstar (now Benchmark), Analog Technologies, and General Dynamics.
Submit a Comment

Your Name


Your Email


Company Name


Country


Comments




Authentication

Please type the number displayed into the box. If you receive an error, you may need to refresh the page and resubmit the information.