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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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Storage Solutions Free Online Demo
Our online demos give our clients a deep insight into our solutions, allowing them to interact with an expert and have their questions answered throughout. Discover our technology wherever you are.
Essegi Automation
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Ask the Experts |
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September 14, 2011 - Updated
September 12, 2011 - Originally Posted
Lead-free Components in a Leaded Process
Can you point me to any tech papers or specifications on the practice of using lead-free components in a leaded process?
R. T.
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Expert Panel Responses |
For leaded parts, no problem (note, do not use 'lead' for Pb as 'lead' can also mean a part with legs).
For parts with solder balls, you need to be very careful. Celestica had some great papers on this topic.
No specifications that I am aware of.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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Reinforce Critical Components on PCBs
Low modulus wire tacking & ruggedizing adhesives hold vital BGAs & VGAs in place, enhancing shock & vibration resistance of electronic assemblies.
Dymax
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