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Thixotropic, Dual Cure Adhesive
Master Bond UV23FLDC-80TK is a dual curing adhesive that withstands rigorous thermal cycling, making it suitable for applications where low stress is critical.
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| Ask the Experts |
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August 17, 2011 - Updated
August 15, 2011 - Originally Posted
BGA Corner Ball Bridging
We are having a problem with BGA component bridging. The problem is specific to one corner ball location on one BGA, but is common to a significant number of circuit board assemblies.
What could be causing this consistent BGA bridging problem?
A. S.
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| Expert Panel Responses |
This is a classic symptom of too much top heat. This excessive heating causes the weaker corners of the BGA to flex and bridge.
Increase your subzone temperature and reduce the topside temperature.
Edward Zamborsky
Regional Sales Manager
OK International Inc.
Ed Zamborsky is a Regional Sales & Technical Support Manager for Thermaltronics, located in New York. His position requires frequent customer visits throughout North America and the Caribbean and his position encompasses not only sales but the role of trainer and master applications engineer for all of Thermaltronics products. His expertise includes such specialties as hand soldering, convection and conduction reflow techniques, array rework, fluid dispensing equipment, and fume extraction. Ed has authored many articles and has presented many papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead-Free Hand Soldering, High Thermal Demand Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework.
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PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
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