| Sponsor |
|
AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
|
|
| Ask the Experts |
|
|
August 9, 2011 - Updated
August 9, 2011 - Originally Posted
Minimum Solder Sphere Count Per Pad
For either type-3 or type-4 solder paste, should there be a minimum number of solder sphere deposited on each surface mount pad?
S. S.
|
| Expert Panel Responses |
Design guide for stencil aperture size (IPC 7525) is least 5 solder balls across the aperture opening.
Bill Coleman
Vice President Technology
Photo Stencil
For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products.
|
|
Submit A Comment
|
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Thermally Conductive, Low Outgassing Epoxy
Master Bond EP21AOLV-2LO is an electrically insulating adhesive that meets NASA low outgassing requirements for sealing, coating and encapsulation applications. Ask an expert.
Master Bond
|
|
|
