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Start Micro Dispensing Today
The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve.
DL Technology
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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| Ask the Experts |
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August 9, 2011 - Updated
August 9, 2011 - Originally Posted
Minimum Solder Sphere Count Per Pad
For either type-3 or type-4 solder paste, should there be a minimum number of solder sphere deposited on each surface mount pad?
S. S.
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| Expert Panel Responses |
Design guide for stencil aperture size (IPC 7525) is least 5 solder balls across the aperture opening.
Bill Coleman
Vice President Technology
Photo Stencil
For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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