circuitnet
Sponsor
DL-Technology

EZ-FLO High Precision Ceramic Dispense Tips
The ceramic molding process allows for smaller more precise inner diameters with a glass-like finish, giving you the ultimate control. Learn more.
DL Technology
Circuit-Technology-Center
Sponsor
kyzen

Is My PCB Wash Concentration in Check
Evaluating wash concentration levels through varying testing methods can potentially save process time, reduce overall process costs, and increase cleaning efficacy on PBCs. Read more.
KYZEN
Ask the Experts
INDEX
ASK
PANEL
JOIN
COMMENT
SEARCH
August 9, 2011 - Updated
August 9, 2011 - Originally Posted

Minimum Solder Sphere Count Per Pad



For either type-3 or type-4 solder paste, should there be a minimum number of solder sphere deposited on each surface mount pad?

S. S.

Expert Panel Responses

Design guide for stencil aperture size (IPC 7525) is least 5 solder balls across the aperture opening.

image
Bill Coleman
Vice President Technology
Photo Stencil
For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products.
Submit A Comment

Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Summit-Interconnect

Fast PCBs, Fully Assembled
Need it fast? Summit delivers quick-turn PCB fabrication and assembly on compressed timelines—no shortcuts, just speed and precision from one source.
Summit Interconnect
Ormet-TLPS