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Electronic Assembly Cleaning Basics
Monitoring & effectively controlling chemistry concentration when cleaning electronic assemblies is crucial for maintaining optimal cleanliness results & preventing costly consequences.
KYZEN
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| Sponsor |
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Reinforce Critical Components on PCBs
UV-curable, low-modulus ruggedizing adhesives secure BGAs/VGAs, improving shock & vibration resistance of electronic assemblies. Low-outgassing version available.
Dymax
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| Ask the Experts |
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August 9, 2011 - Updated
August 9, 2011 - Originally Posted
Minimum Solder Sphere Count Per Pad
For either type-3 or type-4 solder paste, should there be a minimum number of solder sphere deposited on each surface mount pad?
S. S.
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| Expert Panel Responses |
Design guide for stencil aperture size (IPC 7525) is least 5 solder balls across the aperture opening.
Bill Coleman
Vice President Technology
Photo Stencil
For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products.
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Plasma as a Key Technology
Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma ® & PlasmaPlus®.
Plasmatreat GmbH
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