Sponsor |
|
AVOID THE VOID® with Proven Solder Paste
Looking to achieve void reduction and enhanced SIR performance? Indium8.9HF is your proven, no-clean, Pb-free, halogen-free, solder paste solution.
Indium Corporation
|
|
Sponsor |
|
Micro Dispensing Technology Leader
DL Technology LLC develops customized dispensing needles and valves for the electronics assembly, industrial assembly, semiconductor packaging and medical industries.
DL Technology
|
|
Ask the Experts |
|
June 15, 2011 - Updated
June 12, 2011 - Originally Posted
OSP Interval Times for Reflow
When using OSP coated boards, what is the maximum acceptable (and recommended) time interval between reflow of the "first" and "second" sides to ensure proper wetting?
M. G.
|
Expert Panel Responses |
Normally as quick as possible. Without knowing your reflow profile it would be nearly impossible to give an accurate estimate.
Try with a group of scrap boards for 24, 48, 36 hours etc. until you reach a point you are happy with. But 48 hours should be the maximum you aim for due to potential variation on PWB
Richard Boyle
Global Product Champion
Henkel Electronics
Richard Boyle is a Global Product Champion at Henkel Electronics. He has over 25 years experience in the electronics assembly industry and is responsible for the global technical service of all of Henkel's solder materials.
|
Submit A Comment
|
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
Sponsor |
|
TIM1 for EV Battery Thermal Management
AIT's thermal adhesives, grease-gels, & gum-pads offer proven thermal dissipation for a balance of strength, rework ability, & recyclability of EV battery packs.
AI Technology
|
|
|