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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp
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| Ask the Experts |
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August 11, 2010 - Updated
August 9, 2010 - Originally Posted
Solder Mask Contributing To Solder Balls
Is there any relationship between the shape of the solder mask defined area around surface mount pads and the rate at which we see solder balls?
Could increasing or decreasing this area effect solder ball formation?
F. D.
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| Expert Panel Responses |
From my perspective as a chemist, the solder balls form when the surface tension of the solder mask will allow them to form.
Also surface roughness may contribute to their formation by means of allowing a crack or crevice to initiate the formation.
Jim Williams
Chairman
Polyonics, Inc.
Jim Willimas is a PhD Chemist in Polymers and Materials Science. He specialize in printing, cleaning, inks, and coatings used in electronics manufacturng operations. Williams has more than 30 years experience.
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