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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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| Ask the Experts |
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July 28, 2010 - Updated
July 26, 2010 - Originally Posted
Soldermask Insulation Issue
We have an unusual component situation. A long lead on an SMT component is overhanging the pad.
Can solder mask in this area provide an acceptable level of insulation between the overhanging component lead and a circuit conductor running below?
F. A.
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| Expert Panel Responses |
No. Solder masks are not designed as dielectric insulators.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
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