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iX7059 Series by Viscom: Inline X-ray Inspection Power
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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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| Ask the Experts |
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July 28, 2010 - Updated
July 26, 2010 - Originally Posted
Soldermask Insulation Issue
We have an unusual component situation. A long lead on an SMT component is overhanging the pad.
Can solder mask in this area provide an acceptable level of insulation between the overhanging component lead and a circuit conductor running below?
F. A.
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| Expert Panel Responses |
No. Solder masks are not designed as dielectric insulators.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated
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