Sponsor |
|
Prototyping to High-Speed Production
From first builds to 22,000 CPH, Manncorp pick & place machines scale with your budget, space, and output goals—so your line grows as you do. Backed by lifetime support.
Manncorp Inc.
|
|
Sponsor |
|
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
|
|
Ask the Experts |
|
May 19, 2010 - Updated
May 16, 2010 - Originally Posted
Rules for Reusing Components
What are the rules regarding reusing a component?
If you remove a component from a circuit board and the component is functional and not physically damaged, can it be reused on another circuit board?
D. W.
|
Expert Panel Responses |
Reusing components which have been removed from any printed circuit board is risky at best, due to the thermal excursion the component experienced through the assembly cycle and the removal cycle.
Although the thermal profile is predetermined during the assembly process it many times is not during the removal and replacement cycle, which could introduce latent failures in the component.
The other issue which needs to be addressed and this is an issue we faced many years ago at a computer company, is the product cannot be sold as new equipment, as all the components within the system are not new, some have been removed and reinstalled, so the system has to be sold with the caveat "like new."
I know it is a small point but within the limits of the law, it is a point to consider when making the decision to re-use removed components.
Leo Lambert
Vice President, Technical Director
EPTAC Corporation
At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.
|
Submit A Comment
|
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
Sponsor |
|
AI Void Detection - X-Ray Inspection
X-ray Inspection for hidden and buried solder joints. BGA, QFN, THT, and more. High Speed and High Resolution configurations available.
Test Research, Inc.
|
|
|