| Sponsor |
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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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| Sponsor |
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PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
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| Ask the Experts |
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February 24, 2010 - Updated
February 21, 2010 - Originally Posted
Lead Free Percentage
Can anyone offer an estimate on the percentage of non-military circuit board assemblies now being assembled that are lead free?
R. J.
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| Expert Panel Responses |
In the US I would estimate 50 to 60%.
Bob Black
North America Sales Manager
Essegi Automation
Mr. Black was the President and Co-Founder of Zevatech in 1977 and introduced first Pick and Place System at Nepcon West 1980. Bob is now the President, CEO and Co-Founder of Juki Automation Systems. He is also a Co-Founder of the SMEMA Council of IPC. He serves as a member of SMTA and SEMI..
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