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Low Pressure Plasma for Electronics
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Plasmatreat
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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
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| Ask the Experts |
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February 24, 2010 - Updated
February 21, 2010 - Originally Posted
Lead Free Percentage
Can anyone offer an estimate on the percentage of non-military circuit board assemblies now being assembled that are lead free?
R. J.
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| Expert Panel Responses |
In the US I would estimate 50 to 60%.
Bob Black
North America Sales Manager
Essegi Automation
Mr. Black was the President and Co-Founder of Zevatech in 1977 and introduced first Pick and Place System at Nepcon West 1980. Bob is now the President, CEO and Co-Founder of Juki Automation Systems. He is also a Co-Founder of the SMEMA Council of IPC. He serves as a member of SMTA and SEMI..
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