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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
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| Ask the Experts |
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November 5, 2009 - Updated
November 2, 2009 - Originally Posted
What Is The Ideal HASL Thickness?
What is the ideal solder thickness for hot air solder leveled (HASL) lead free boards?
K. S. G.
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| Expert Panel Responses |
The ideal thickness is to be thick enough for good solderability, yet thin (flat) enough for part placement. Because of the HASL process and surface tension of solder, smaller pads will have a greater amount of solder as compared to larger pads.
Due to this and coupled with lead free HASL having an inter-metallic two times that of leaded HASL a minimum thickness is more crucial in the lead free process than the tin/lead process.
It is difficult to spec in a certain thickness because of the process so we (Florida Cirtech) concentrate on a minimum thickness and not on a range. Our recommended minimum thickness would be 100 microinches as this should insure good solderability.
Mike Scimeca
President
FCT Assembly
Mike Scimeca created FCT Assembly after the purchase of Fine Line Stencil, Inc., and consists of two major operations: stencil manufacturing and the manufacturing of electronic assembly products such as solder paste, flux and solder bar.
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Catch Defects Before They Cost You
3D AOI analyzes true solder height, contour, and volume to expose defects 2D systems miss—reducing false calls, rework, and escapes on ultra-compact components.
Manncorp Inc.
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