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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
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| Ask the Experts |
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July 15, 2009 - Updated
July 13, 2009 - Originally Posted
Thermal cycle limit
How many thermal cycles can we expose a Class 3 printed wiring assemblies to before it will no longer maintain a Class 3 rating?
In general how many thermal cycles should we allow at a given location on a circuit board, such as at a BGA site, before we should consider the assembly compromised and thus may be unreliable at any Class rating?
P. W.
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| Expert Panel Responses |
You are mixing and matching terminologies. Class 3 is a manufacturing specification. Thermal cycling has nothing to do with manufacturing.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
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