| Sponsor |
|
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
|
|
| Sponsor |
|
Storage Solutions – Free Online Demo
Our online demos give our clients a deep insight into our solutions, allowing them to interact with an expert and have their questions answered throughout. Discover our technology wherever you are.
Essegi Automation
|
|
| Ask the Experts |
|
|
July 15, 2009 - Updated
July 13, 2009 - Originally Posted
Thermal cycle limit
How many thermal cycles can we expose a Class 3 printed wiring assemblies to before it will no longer maintain a Class 3 rating?
In general how many thermal cycles should we allow at a given location on a circuit board, such as at a BGA site, before we should consider the assembly compromised and thus may be unreliable at any Class rating?
P. W.
|
| Expert Panel Responses |
You are mixing and matching terminologies. Class 3 is a manufacturing specification. Thermal cycling has nothing to do with manufacturing.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
|
|
Submit A Comment
|
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Reinforce Critical Components on PCBs
Low modulus wire tacking & ruggedizing adhesives hold vital BGAs & VGAs in place, enhancing shock & vibration resistance of electronic assemblies.
Dymax
|
|
|
