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| Ask the Experts |
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July 15, 2009 - Updated
July 13, 2009 - Originally Posted
Thermal cycle limit
How many thermal cycles can we expose a Class 3 printed wiring assemblies to before it will no longer maintain a Class 3 rating?
In general how many thermal cycles should we allow at a given location on a circuit board, such as at a BGA site, before we should consider the assembly compromised and thus may be unreliable at any Class rating?
P. W.
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| Expert Panel Responses |
You are mixing and matching terminologies. Class 3 is a manufacturing specification. Thermal cycling has nothing to do with manufacturing.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
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