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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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| Sponsor |
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Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
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| Ask the Experts |
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April 27, 2009 - Updated
April 27, 2009 - Originally Posted
Pick and Place System to Insert Radial Lead Devices
Are there standard SMT Pick and Place Systems that can also insert radial lead devices?
K. A.
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| Expert Panel Responses |
Yes, we at Juki do quite a bit of insertion of radial parts.
We have a variety of nozzles, including gripper nozzles, which can be used for insertion of radials or through-hole connectors.
Let us know and we'll be happy to look at your application.
Bob Black
North America Sales Manager
Essegi Automation
Mr. Black was the President and Co-Founder of Zevatech in 1977 and introduced first Pick and Place System at Nepcon West 1980. Bob is now the President, CEO and Co-Founder of Juki Automation Systems. He is also a Co-Founder of the SMEMA Council of IPC. He serves as a member of SMTA and SEMI..
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Catch Defects Before They Cost You
3D AOI analyzes true solder height, contour, and volume to expose defects 2D systems miss—reducing false calls, rework, and escapes on ultra-compact components.
Manncorp Inc.
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