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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
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| Ask the Experts |
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April 29, 2009 - Updated
April 27, 2009 - Originally Posted
Leaded components in a no lead process
We will be assembling circuit boards using an RoHS complient assembly line, however our customer does not have an RoHS lead free requirement. Are there any concerns if we use a few leaded components in this process? Are we likely to contaminate our wave solder bath?
J. B.
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| Expert Panel Responses |
It isn't going to be an issue of lead contamination so much as it might be an issue with reliability. We have seen issues with cracking when the lead gets above .4% in the solder joint.
Our suggestion would be to wait to go to lead free until you have all leaded components switched.
Mike Scimeca
President
FCT Assembly
Mike Scimeca created FCT Assembly after the purchase of Fine Line Stencil, Inc., and consists of two major operations: stencil manufacturing and the manufacturing of electronic assembly products such as solder paste, flux and solder bar.
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