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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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| Ask the Experts |
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November 10, 2008 - Updated
November 10, 2008 - Originally Posted
Cleaning Under 0603 Components
Cleaning problems have arisen with our RoHS board assembly process, specifically under surface mounted 0603 components.
Should we consider removing the solder mask under these parts to allow for better cleaning or could the problem be a cleaning process problem?
Are there other procedures we can follow that are not as labor intensive than removing decals & solder mask?
B. P.
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| Expert Panel Responses |
I response to your question about improved cleaning under the 0603 low standoff components we would recommend presoaking the boards in the wash chemistry for 30-60 seconds at 150-160F.
It would help is I could have the details of the cleaning process and chemicals. We have been effective at cleaning below the 0603 components with saponified low pressure cleaning in our Aquastorm 200.
Terry Munson
President/Senior Technical Consultant
Foresite
Mr. Munson, President and Founder of Foresite, has extensive electronics industry experience applying Ion Chromatography analytical techniques to a wide spectrum of manufacturing applications.
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