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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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| Sponsor |
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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| Ask the Experts |
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October 20, 2008 - Updated
October 20, 2008 - Originally Posted
Types of Pad Contamination
How many types of pad contamination have been identified to date? For example, I know that there can be phosphorous and chlorine contamination.
Can this type of contamination occur while the board is being populated due to fluxes or poor thermal profiles?
It seems that the popular opinion is that it primarily takes place during the plating process.
E. F.
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| Expert Panel Responses |
We have found pads with high levels of sulfate, sodium, ammine, rosin, and nitrate besides the chloride and phosphate contamination.
Terry Munson
President/Senior Technical Consultant
Foresite
Mr. Munson, President and Founder of Foresite, has extensive electronics industry experience applying Ion Chromatography analytical techniques to a wide spectrum of manufacturing applications.
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