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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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| Ask the Experts |
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September 8, 2008 - Updated
September 8, 2008 - Originally Posted
Halogen Free tin lead or pb free
How can you determine whether a PCB is Halogen lead free or Halogen free tin lead?
P. S.
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| Expert Panel Responses |
In this age of the EU directive, you should demand a material declaration sheet from the supplier who will identify the elements within the board.
There is also an IPC 1066, Labeling of PCBs and Assemblies, which list the various types of metals and assigned a code letter for the board which defines the alloy used to fabricated the board.
Leo Lambert
Vice President, Technical Director
EPTAC Corporation
At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
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