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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
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SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
SEHO Systems GmbH
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| Ask the Experts |
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September 8, 2008 - Updated
September 8, 2008 - Originally Posted
Halogen Free tin lead or pb free
How can you determine whether a PCB is Halogen lead free or Halogen free tin lead?
P. S.
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| Expert Panel Responses |
In this age of the EU directive, you should demand a material declaration sheet from the supplier who will identify the elements within the board.
There is also an IPC 1066, Labeling of PCBs and Assemblies, which list the various types of metals and assigned a code letter for the board which defines the alloy used to fabricated the board.
Leo Lambert
Vice President, Technical Director
EPTAC Corporation
At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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