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May 5, 2008

Automated VS Manual Depanelization

For the depanelization of pcb's in a high mix production line environment, is there a laser depanelizing machine or water cutting machine that would allow us to avoid for avoid manual depanelization?

Note: We are using "V" cut panel pcb's.

F. C.

Experts Comments

Depaneling is a major concern for almost anybody in a flexible manufacturing environment. The problem is that all manual technologies available are high –stress technologies, versus the automated depaneling with a saw or shaft router requiring tooling and that can get very expensive for a big product mix.

The latest depaneling technology is laser depaneling, which offers a low stress – no dust technology. The limitation for this technology to take off seems to be the capital investment for the equipment and the limit in board thickness. ASYS offers a semi-automatic system and an inline system that can cut FR4 material up to 1.2mm thickness.

Unfortunately both units still require tooling, although it is a lot simpler and cheaper than for a traditional depaneling system.

Please contact me for more information or visit our website at http://www.asys-group.com/

Markus Wilkens
Mr. Wilkens has been working in the SMD industry for over 10 years. He came to the USA in 1999 to start up the operations for ASYS, a global company with a product portfolio including Handling Systems, Marking Systems, Depaneling Systems, Screen Printers and end of line Automation.
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