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Start Micro Dispensing Today
The DL Micro Valve is specifically designed for dispensing micro volumes of material in precise, repeatable patterns. Learn more about the DL Micro Valve.
DL Technology
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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Ask the Experts |
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March 3, 2008 - Updated
March 3, 2008 - Originally Posted
Type IV solder paste on 0201 application
Can I use type IV solder paste on 0201 application?
If it can be used, can you explain why it is an acceptable choice?
T. S. Y.
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Expert Panel Responses |
Type 4 would be the paste of choice for 0201 applications. Rule of thumb is the stencil aperture size should at least 5 times larger than the average paste particle size. For type 4 the average particle size is roughly 30 microns. 5x that is 150 microns. Aperture size for 0201 are typically 200 to 250 microns.
Bill Coleman
Vice President Technology
Photo Stencil
For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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