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Electronic Assembly Cleaning Basics
Monitoring & effectively controlling chemistry concentration when cleaning electronic assemblies is crucial for maintaining optimal cleanliness results & preventing costly consequences.
KYZEN
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Reinforce Critical Components on PCBs
UV-curable, low-modulus ruggedizing adhesives secure BGAs/VGAs, improving shock & vibration resistance of electronic assemblies. Low-outgassing version available.
Dymax
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| Ask the Experts |
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March 3, 2008 - Updated
March 3, 2008 - Originally Posted
Type IV solder paste on 0201 application
Can I use type IV solder paste on 0201 application?
If it can be used, can you explain why it is an acceptable choice?
T. S. Y.
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| Expert Panel Responses |
Type 4 would be the paste of choice for 0201 applications. Rule of thumb is the stencil aperture size should at least 5 times larger than the average paste particle size. For type 4 the average particle size is roughly 30 microns. 5x that is 150 microns. Aperture size for 0201 are typically 200 to 250 microns.
Bill Coleman
Vice President Technology
Photo Stencil
For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products.
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Plasma as a Key Technology
Plasma technology improves electronics manufacturing, reduces oxide layers, prevents delamination & enables environmentally friendly products by using Openair-Plasma ® & PlasmaPlus®.
Plasmatreat GmbH
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