| Sponsor |
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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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| Sponsor |
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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| Ask the Experts |
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March 3, 2008 - Updated
March 3, 2008 - Originally Posted
Type IV solder paste on 0201 application
Can I use type IV solder paste on 0201 application?
If it can be used, can you explain why it is an acceptable choice?
T. S. Y.
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| Expert Panel Responses |
Type 4 would be the paste of choice for 0201 applications. Rule of thumb is the stencil aperture size should at least 5 times larger than the average paste particle size. For type 4 the average particle size is roughly 30 microns. 5x that is 150 microns. Aperture size for 0201 are typically 200 to 250 microns.
Bill Coleman
Vice President Technology
Photo Stencil
For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products.
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