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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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| Ask the Experts |
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February 4, 2008 - Updated
February 3, 2008 - Originally Posted
Voiding after under-fill
During our under-fill process we are noticing voiding after the fact.
Is there a tool used to see or test for voiding in an under-fill process?
R.W.
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| Expert Panel Responses |
The primary tool for this activity would be acoustic microscopy. There are primarily two companies in this space: Sonix and Sonoscan. You could also possibly use an infrared camera if the underfill is used for heat dissipation.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
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