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5 Keys to Component Lead Tinning Success
Re-conditioning of electronic components mitigates gold embrittlement, eliminates tin whiskers enhancing quality and sustainability prior to soldering.
BEST Inc.
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| Ask the Experts |
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February 4, 2008 - Updated
February 3, 2008 - Originally Posted
Voiding after under-fill
During our under-fill process we are noticing voiding after the fact.
Is there a tool used to see or test for voiding in an under-fill process?
R.W.
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| Expert Panel Responses |
The primary tool for this activity would be acoustic microscopy. There are primarily two companies in this space: Sonix and Sonoscan. You could also possibly use an infrared camera if the underfill is used for heat dissipation.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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