| Sponsor |
|
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
|
|
| Sponsor |
|
SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
SEHO Systems GmbH
|
|
| Ask the Experts |
|
|
January 14, 2008 - Updated
January 14, 2008 - Originally Posted
Lead Free Surface Finish
What is the shelf life for PCB's with a Sn/Ag/Cu surface finish (96.5/3.0/0.5)?
Can you steer me to some supporting documentation?
J. O.
|
| Expert Panel Responses |
There is limited data on shelf life for SAC HASL
I would recommend you use the IPC steam aging test to independently confirm shelf life.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
|
|
Submit A Comment
|
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
|
|
|