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iX7059 Series by Viscom: Inline X-ray Inspection Power
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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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| Ask the Experts |
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January 14, 2008 - Updated
January 14, 2008 - Originally Posted
Lead Free Surface Finish
What is the shelf life for PCB's with a Sn/Ag/Cu surface finish (96.5/3.0/0.5)?
Can you steer me to some supporting documentation?
J. O.
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| Expert Panel Responses |
There is limited data on shelf life for SAC HASL
I would recommend you use the IPC steam aging test to independently confirm shelf life.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
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