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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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| Ask the Experts |
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January 14, 2008 - Updated
January 14, 2008 - Originally Posted
Lead Free Surface Finish
What is the shelf life for PCB's with a Sn/Ag/Cu surface finish (96.5/3.0/0.5)?
Can you steer me to some supporting documentation?
J. O.
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| Expert Panel Responses |
There is limited data on shelf life for SAC HASL
I would recommend you use the IPC steam aging test to independently confirm shelf life.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
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