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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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Storage Solutions Free Online Demo
Our online demos give our clients a deep insight into our solutions, allowing them to interact with an expert and have their questions answered throughout. Discover our technology wherever you are.
Essegi Automation
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Ask the Experts |
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January 14, 2008 - Updated
January 14, 2008 - Originally Posted
Lead Free Surface Finish
What is the shelf life for PCB's with a Sn/Ag/Cu surface finish (96.5/3.0/0.5)?
Can you steer me to some supporting documentation?
J. O.
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Expert Panel Responses |
There is limited data on shelf life for SAC HASL
I would recommend you use the IPC steam aging test to independently confirm shelf life.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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Reinforce Critical Components on PCBs
Low modulus wire tacking & ruggedizing adhesives hold vital BGAs & VGAs in place, enhancing shock & vibration resistance of electronic assemblies.
Dymax
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