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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
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| Ask the Experts |
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December 10, 2007 - Updated
December 9, 2007 - Originally Posted
Impact of humidity on wave soldering process
How does a low humidity environment (<30%) affect the wave soldering process?
Is there any impact to the solder joints?
Oscar Jaquez
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| Expert Panel Responses |
Low humidity is not a problem and is recommended to keep the humidity level down to 40% or less in a electronics manufacturing environment.
The problem is with higher humidity levels in that circuit boards will absorb higher levels of water and cause defects such as blow holes and even blistering of the PCB.
If you are keeping <30% humidity in your factory that is a good thing for manufacturing in wave soldering as well as SMT glue and solder past printing.
Greg Hueste
Senior Applications Engineer
Speedline Technologies
Greg joined Electrovert in February 1984. Based out of the Electrovert applications laboratory in Camdenton Missouri, Greg has been in the process applications support role since 2000. His primary responsibilities include providing process and machine applications support for the wave soldering lines as well as process, machine and operations training. He also provides applications support for the reflow and cleaner lines. Greg is a PBET certified trainer and holds two patents on wave solder nozzle design.
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Catch Defects Before They Cost You
3D AOI analyzes true solder height, contour, and volume to expose defects 2D systems miss—reducing false calls, rework, and escapes on ultra-compact components.
Manncorp Inc.
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