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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ºC
Ormet® TLPS
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PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
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| Ask the Experts |
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December 10, 2007 - Updated
December 9, 2007 - Originally Posted
Impact of humidity on wave soldering process
How does a low humidity environment (<30%) affect the wave soldering process?
Is there any impact to the solder joints?
Oscar Jaquez
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| Expert Panel Responses |
Low humidity is not a problem and is recommended to keep the humidity level down to 40% or less in a electronics manufacturing environment.
The problem is with higher humidity levels in that circuit boards will absorb higher levels of water and cause defects such as blow holes and even blistering of the PCB.
If you are keeping <30% humidity in your factory that is a good thing for manufacturing in wave soldering as well as SMT glue and solder past printing.
Greg Hueste
Senior Applications Engineer
Speedline Technologies
Greg joined Electrovert in February 1984. Based out of the Electrovert applications laboratory in Camdenton Missouri, Greg has been in the process applications support role since 2000. His primary responsibilities include providing process and machine applications support for the wave soldering lines as well as process, machine and operations training. He also provides applications support for the reflow and cleaner lines. Greg is a PBET certified trainer and holds two patents on wave solder nozzle design.
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