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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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| Ask the Experts |
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November 12, 2007 - Updated
November 12, 2007 - Originally Posted
The Role of Formic Acid
Does Formic Acid play an important role in solder paste for lead free?
Peter Gong
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| Expert Panel Responses |
Formic acid is one of the weak organic acids that can be used in no-clean formulations to prepare the conductor surface for solder wetting. So, in that regards, it can play an important role in solder paste for lead free. My apologies, but the question is somewhat vague. Can the questioner provide more specifics?
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
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