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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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Storage Solutions – Free Online Demo
Our online demos give our clients a deep insight into our solutions, allowing them to interact with an expert and have their questions answered throughout. Discover our technology wherever you are.
Essegi Automation
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| Ask the Experts |
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November 12, 2007 - Updated
November 12, 2007 - Originally Posted
The Role of Formic Acid
Does Formic Acid play an important role in solder paste for lead free?
Peter Gong
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| Expert Panel Responses |
Formic acid is one of the weak organic acids that can be used in no-clean formulations to prepare the conductor surface for solder wetting. So, in that regards, it can play an important role in solder paste for lead free. My apologies, but the question is somewhat vague. Can the questioner provide more specifics?
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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Reinforce Critical Components on PCBs
Low modulus wire tacking & ruggedizing adhesives hold vital BGAs & VGAs in place, enhancing shock & vibration resistance of electronic assemblies.
Dymax
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