| Sponsor |
|
iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
|
|
| Sponsor |
|
Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
|
|
| Ask the Experts |
|
|
November 12, 2007 - Updated
November 12, 2007 - Originally Posted
The Role of Formic Acid
Does Formic Acid play an important role in solder paste for lead free?
Peter Gong
|
| Expert Panel Responses |
Formic acid is one of the weak organic acids that can be used in no-clean formulations to prepare the conductor surface for solder wetting. So, in that regards, it can play an important role in solder paste for lead free. My apologies, but the question is somewhat vague. Can the questioner provide more specifics?
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
|
|
Submit A Comment
|
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated
|
|
|
