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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
SEHO Systems GmbH
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| Ask the Experts |
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November 12, 2007 - Updated
November 12, 2007 - Originally Posted
The Role of Formic Acid
Does Formic Acid play an important role in solder paste for lead free?
Peter Gong
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| Expert Panel Responses |
Formic acid is one of the weak organic acids that can be used in no-clean formulations to prepare the conductor surface for solder wetting. So, in that regards, it can play an important role in solder paste for lead free. My apologies, but the question is somewhat vague. Can the questioner provide more specifics?
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
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