circuitnet
Sponsor
Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Summit-Interconnect
Sponsor
SEHO

SEHO makes production lines smarter
Improve your work flow and reduce manufacturing costs with creative ideas and innovative solutions for automation, board handling and material management.
SEHO Systems GmbH
Ask the Experts
INDEX
ASK
PANEL
JOIN
COMMENT
SEARCH
November 12, 2007 - Updated
November 12, 2007 - Originally Posted

The Role of Formic Acid



Does Formic Acid play an important role in solder paste for lead free?

Peter Gong

Expert Panel Responses

Formic acid is one of the weak organic acids that can be used in no-clean formulations to prepare the conductor surface for solder wetting. So, in that regards, it can play an important role in solder paste for lead free. My apologies, but the question is somewhat vague. Can the questioner provide more specifics?

image
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
Submit A Comment

Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Master-Bond

Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
Smart-Sonic