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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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Storage Solutions – Free Online Demo
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Essegi Automation
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| Ask the Experts |
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July 16, 2007 - Updated
July 24, 2007 - Originally Posted
Acceptable "reject rate" for hand assembly
What is an What is an acceptable "reject rate" for a total hand assembly, through hole operation line. I have established a less than .10% of all total hand placed through hole components for our load room.
We are a small low volume, high mix firm, using through hole boards, wave soldered. Is this a reasonable level to expect from our process?
Robert Bartolotta
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| Expert Panel Responses |
Typical first pass yield on hand assembly is 5000 ppm.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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Reinforce Critical Components on PCBs
Low modulus wire tacking & ruggedizing adhesives hold vital BGAs & VGAs in place, enhancing shock & vibration resistance of electronic assemblies.
Dymax
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