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Prototyping to High-Speed Production
From first builds to 22,000 CPH, Manncorp pick & place machines scale with your budget, space, and output goals—so your line grows as you do. Backed by lifetime support.
Manncorp Inc.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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| Ask the Experts |
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May 1, 2006 - Updated
July 5, 2007 - Originally Posted
What is the best solder lead free alloy for step solder process on assemblies with SAC305?
What is the best solder lead free alloy for step solder process on assemblies with SAC305?
T.C.
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| Expert Panel Responses |
The work done by the IPC Solder Product Value Council no discernible difference between the various SAC alloys that were studied therefore if you already have SAC305 in your process and on the assembly then it is desirable that you stay with that alloy for all soldering applications for that assembly. This will eliminate the opportunity for the generation of any none eutectic alloys which have the potential for reliability issues. Also using a single alloy will make it easier should any rework or repair ever be needed in the future.
Neil Poole
Senior Applications Chemist
Henkel Electronics
Dr. Poole is a Senior Applications Chemist in Henkel Technologies, electronics assembly materials application engineering group. He is responsible for all of Henkel's assembly products including soldering products, underfills, PCB protection materials, and thermally conductive adhesives.
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AI Void Detection - X-Ray Inspection
X-ray Inspection for hidden and buried solder joints. BGA, QFN, THT, and more. High Speed and High Resolution configurations available.
Test Research, Inc.
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