| Sponsor |
|
iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
|
|
| Sponsor |
|
Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
|
|
| Ask the Experts |
|
|
May 22, 2006 - Updated
July 5, 2007 - Originally Posted
Failure at the ENIG finish on the BGA substrate
On May 7, B.G. asked a question about BGA joint failures on ENIG finished boards. We have a similar problem, but the failure is at the ENIG finish on the BGA substrate. The part is an Alterra Stratix package, and we see the issue in at least 3 different applications. The failure happens in downstream assembly operations, sometime after the board-level boundary scan testing. Is this a common problem?
J.K.
|
| Expert Panel Responses |
We are dealing with a similar issue at this time. Most BGAs are electrolytic nickel/immersion gold, but sometimes you have an ENIG finish, which can be susceptible to black pad. Where are the failure points? Do you see mud-cracking?
You could also be simply overloading the package, as SnNi intermetallics are weaker than SnCu. Have you measured the board level strain during manufacturing in that general vicinity?
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
|
|
Submit A Comment
|
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated
|
|
|
