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Discover consistency for your operations
Explore the reliable solutions for jet dispensing, conformal coating, plasma treatment, and selective soldering from Nordson.
Nordson Electronics Solutions
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| Ask the Experts |
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May 29, 2006 - Updated
July 5, 2007 - Originally Posted
Difference between ENIG and Flash?
With PCB plating what's the difference between ENIG and Flash?
Mike Johnson
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| Expert Panel Responses |
You are comparing apples to oranges. ENIG describes materials (nickel and gold) and processes (electroless for nickel and immersion for gold). Flash describes the plating thickness. Flash typically means a very thin (3 to 10 microinches) coating of gold, regardless of the process. Therefore, flash gold could be electrolytic, electroless, or immersion. Initial problems with flash gold in the 1990's tend to refer to an electroless process used over separable connectors that resulted in galvanic-driven pore corrosion.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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Flux Technology Development for Solder Paste
This paper introduces a newly developed flux technology compatible with formic acid reduction reflow ovens which offers solutions to the issues associated with conventional power device soldering.
Koki Americas
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