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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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| Ask the Experts |
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May 29, 2006 - Updated
July 5, 2007 - Originally Posted
Difference between ENIG and Flash?
With PCB plating what's the difference between ENIG and Flash?
Mike Johnson
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| Expert Panel Responses |
You are comparing apples to oranges. ENIG describes materials (nickel and gold) and processes (electroless for nickel and immersion for gold). Flash describes the plating thickness. Flash typically means a very thin (3 to 10 microinches) coating of gold, regardless of the process. Therefore, flash gold could be electrolytic, electroless, or immersion. Initial problems with flash gold in the 1990's tend to refer to an electroless process used over separable connectors that resulted in galvanic-driven pore corrosion.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated
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