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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
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| Ask the Experts |
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June 11, 2006 - Updated
July 5, 2007 - Originally Posted
RoHS compliance of assembly machine transferred to European facility
As a buyer of SMT assembly equipment, do I need to be concerned about RoHS compliance of new assembly machines in case I need to transfer a machine to one of our European facilities?
Carl Newman, Consultant
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| Expert Panel Responses |
Absolutely. You can not ship equipment containing lead into the EU.
Bob Black
North America Sales Manager
Essegi Automation
Mr. Black was the President and Co-Founder of Zevatech in 1977 and introduced first Pick and Place System at Nepcon West 1980. Bob is now the President, CEO and Co-Founder of Juki Automation Systems. He is also a Co-Founder of the SMEMA Council of IPC. He serves as a member of SMTA and SEMI..
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