August 7, 2006
Lead-free transition using HAL lead-free boards
For certain customers we are planning a lead-free transition period. This means that orders can be produced lead-free or lead containing. Due to the lead-time for bare boards we order the boards lead-free and decide later if we will produce lead-free or not. Do you have any concerns or recommendations on reflow and wave soldering with HAL lead-free board finish with a lead containing process?
H.S.
Reverse compatibility is not an issue. The HASL coating either SAC or SN100C will work fine with a tin lead process. If you are running a high volume manufacturing using SAC HASL you may want to set up an analytical service to monitor silver build up. With Sn100C that would not be necessary.
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Karl Seelig
Vice President of Technology
AIM
In his 32 years of industry experience, Mr. Seelig has authored over 30 published articles on topics including lead-free assembly, no-clean technology, and process optimization. Karl holds numerous patents, including four for lead-free solder alloys, and was a key developer of no-clean technology.
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