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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
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| Ask the Experts |
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August 21, 2006 - Updated
July 5, 2007 - Originally Posted
Small hole via plating reliability
Where would I find studies on small hole (.006"-.010" mechanical drill) via plating reliability?
R.O.
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| Expert Panel Responses |
Plating reliability tends to be a function of hole size only with the respect to aspect ratio (board thickness/hole diameter). See IPC TR-579 for reliability predictions. However, you seem to be suggesting concerns with hole quality? Please feel free to contact me directly to help resolve your question.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
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